Circuit board and a method for making the same

ABSTRACT

A method for making a multi-layer electronic circuit board  136  having electroplated apertures  96, 98  which may be selectively and electrically isolated from an electrically grounded member  46  and further having selectively formed air bridges and/or crossover members  128  which are structurally supported by material  134.

FIELD OF THE INVENTION

[0001] The present invention relates to an electronic circuit board and a method for making an electronic circuit board and more particularly, to a multi-layer electronic circuit board having metallized apertures which are selectively isolated and/or disconnected from an electrical ground plane and further having selectively formed air bridges and/or crossover circuits.

BACKGROUND OF THE INVENTION

[0002] Multi-layer circuit boards operatively receive electronic components and allow the received components to be desirably interconnected and to selectively and cooperatively form electrical circuits. Particularly, these components are operatively received upon opposed board surfaces and within certain interior portions of the board, thereby desirably allowing each of the electronic circuit boards to contain a relatively large amount of components which efficiently, respectively, and densely populate the respective boards.

[0003] It is desirable to allow each of the component containing surfaces or portions of a created and/or formed electronic circuit board to communicate and/or be selectively interconnected, thereby allowing the contained electronic components to cooperatively and selectively form a relatively large number of desired electrical circuits. This desired communication and/or interconnection typically requires the use of shared electrical ground planes, the transmittal of electrical power and/or control type signals between some or all of the component containing surfaces or board portions, and/or the connection of components on each of the opposed surfaces and/or within and between certain of the interior portions and the top and/or bottom and/or other board surfaces.

[0004] This desired interconnection typically requires that one or more holes be formed or drilled through each of the circuit boards, thereby creating at least one “through hole” or “via” traversing between each of the opposed component containing surfaces and through the various interior circuit board portions. Typically this drilling process is relatively complex and time consuming, thereby increasing the overall circuit board production cost. This drilling process also undesirably damages and/or destroys many of the circuit boards, thereby further increasing overall production costs.

[0005] Further, it is desirable to form “air-bridges” or “crossover type circuits” upon one or more selected surfaces and/or within certain component containing portions of the formed circuit board in order to allow multiple levels of circuits and/or electrical interconnections to be formed upon a single board surface and/or within a certain component containing portion of the circuit board, thereby desirably increasing the amount of electrical circuits which may be created upon and/or within the created circuit board (e.g., increasing the density of the contained electrical circuitry).

[0006] These “air-bridges” or crossover circuits are typically formed by rather complicated, costly, and time consuming processes. The formed bridges and crossover circuits further do not typically and efficiently accommodate certain desirable circuit board interconnection processes, techniques, and/or methodologies such as and without limitation, the use of relatively heavy wire bonding (e.g., aluminum wire having a diameter of about five to about twenty millimeters) or the direct connection of components to a surface of the board.

[0007] There is therefore a need to provide an electronic circuit board and a method for producing a multi-layer electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior electronic circuit boards and methods for making a circuit board, which selectively allows grounded and non-grounded “vias” to be desirably and selectively and efficiently formed in a cost effective manner, and which further allows for the efficient and selective formation of air-bridge members or crossover circuits which desirably accommodate diverse types of circuit interconnection processes, and which increase the circuitry density within the formed electronic circuit board.

SUMMARY OF THE INVENTION

[0008] It is a first object of the present invention to provide an electronic circuit board and a method for producing an electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior multi-layer electronic circuit boards and of prior electronic circuit board forming methodologies and techniques.

[0009] It is a second object of the invention to provide a method for producing a multi-layer electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior multi-layer electronic circuit board forming methodologies and techniques, which allows for the formation or creation of an electronic circuit board which selectively receives various electronic components, which allows for the selective, efficient, and reliable formation of metallized apertures, within the formed and/or created electronic circuit board, which cooperatively allow for communication by and between these various electronic components and which further cooperatively allow for the selective interconnection of these contained components.

[0010] It is a third object of the invention to provide a method for producing a multi-layer electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior multi-layer electronic circuit board forming methodologies and techniques and which allows for the selective formation of metallized apertures within a circuit board, which may be selectively connected or disconnected and/or selectively isolated from a formed electrical ground plane or bus.

[0011] It is a fourth object of the invention to provide a method for producing a multi-layer electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior multi-layer electronic circuit board forming methodologies and techniques and which allows for the selective and efficient formation of air bridges and/or crossover circuits and/or crossover members which are adapted to accommodate a wide variety of component interconnections, assemblies, techniques, and/or methodologies.

[0012] According to a first aspect of the present invention, a method for making an electric circuit board is provided. The method includes the steps of providing a first member having a core which is contained between a first and a second layer of material; providing a second member having a core which is contained between a first and a second layer of material; providing a first and a second layer of a first material; providing a third member; removing a portion of the top and the bottom layer of the first member, thereby exposing a first and a second portion of the core of the first member; removing a portion of the top and bottom layer of the second member, thereby exposing a first and a second portion of the core of the second member; creating a first pre-circuit assembly by attaching the first layer of first material to a first surface of the third member, attaching the second layer of first material to a second surface of the third member, attaching the first member to the first layer of first material, and attaching the second member to the second layer of first material; creating an aperture through the first pre-circuit assembly, thereby exposing a first surface of the first pre-circuit assembly within the aperture; applying an electrically conductive material to the exposed first surface of the third pre-circuit assembly; and selectively removing portions of the core, thereby creating at least one air-bridge and forming an electrical circuit assembly.

[0013] According to a second aspect of the present invention a circuit assembly is provided. The circuit assembly is made by the process of forming a first pre-circuit assembly having a first core member having a first and a second surface, a first plurality of electrically conductive members disposed upon the first surface, and a second plurality of electrically conductive members disposed upon the second surface; forming a second pre-circuit assembly having first and second circuit boards which are selectively attached to a dielectric adhesive material and which cooperatively form a separation region; coupling the dielectric adhesive material to the second plurality of electrically conductive portions; removing certain portions of the first core member, thereby forming a pedestal portion which abuts the separation region; extending the separation through the pedestal portion, thereby forming a circuit board.

[0014] According to a third aspect of the present invention, a circuit board is provided and comprises a first electrically conductive member having a first and a second surface; a first dielectric member which is coupled to the first surface; a second dielectric member which is coupled to the second surface; a first circuit assembly having a second electrically conductive member which is coupled to the first dielectric member, the first circuit assembly further including a third electrically conductive member and a first core member which is contained between the second and the third electrically conductive members and which includes at least one air-bridge; and a second circuit assembly having a fourth electrically conductive member which is coupled to the second dielectric member, the second circuit assembly further including a fifth electrically conductive member and a second core member which is contained between the fourth and the fifth electrically conductive members and which includes at least one air-bridge, the second circuit assembly cooperating with the first circuit assembly and with the first and second dielectric material and with the first electrically conductive member to form a multi-layer circuit board.

[0015] These and other objects, aspects, and advantages of the present invention will become apparent upon reading the following detailed description in combination with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIGS. 1(a)-(m) are successive sectional side views of a multi-layer circuit board being produced and/or formed in accordance with the teachings of the preferred embodiment of the invention;

[0017]FIG. 2 is a top perspective fragmented view of the multi-layer circuit board assembly shown in FIG. 1(l);

[0018] FIGS. 3(a)-(f) are successive sectional side views of a multi-layer circuit board assembly being produced and/or formed in accordance with the teaching of a second embodiment of the invention; and

[0019] FIGS. 4(a)-(f) are successive sectional side views of a multi-layer circuit board assembly being produced and/or formed in accordance with the teachings of a third embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INVENTION

[0020] Referring now to FIGS. 1(a)-(m), there is shown a process 10 for making an electronic circuit board assembly in accordance with the teachings of the preferred embodiment of the invention. Particularly, process 10 begins by obtaining and/or providing a member 12 having a first core portion 14 which is operatively contained between a top and a bottom layer or a top or first and a bottom or second member 16, 18, as best shown in FIG. 1(a). It should be appreciated that the terms “first” and “second” should not be limited to the layers and/or members to which they specifically refer to within this specification (e.g., the term “first” may alternatively refer to bottom layer or member 18).

[0021] In one non-limiting embodiment of the invention, core portion or member 14 comprises conventional and commercially available aluminum material while layers/members 16, 18 comprise conventional, commercially available and substantially identical electrically conductive material, such as copper. As further shown best in FIG. 1(a), certain portions of layers/members 16, 18 are removed by a conventional etching process in order to create selectively formed apertures 20 within the layers 16, 18, thereby creating exposed “areas” or surface portions 22, 24, 26, 28, 30, 32, 34, 36, 38, and 40 of the core member 14. In one non-limiting embodiment of the invention, portions or pairs 22, 32; 24, 34; 26, 36; 28, 38; and 30, 40 are respectively aligned (e.g., portions 32, 34, 36, 38, 40 are respectively and wholly resident under portions 22, 24, 26, 28, and 30, and portions 32, 34, 36, 38, and 40 are respectively identical in size and shape to portions 22, 24, 26, 28, and 30). In a further non-limiting embodiment of the invention, portions 22, 24, 26, 28, 30, 32, 34, 36, 38, and 40 are each substantially similar in size and shape.

[0022] In one non-limiting embodiment of the invention, the thickness of the core member 14 is about fifty to two hundred micrometers while the thickness of portions 16, 18 is substantially identical and is about five to one hundred micrometers. Other sizes, shapes, thicknesses, and/or dimensions of members 14-18 may be utilized.

[0023] Process 10, as shown best in FIGS. 1(b) and 1(d), requires the acquisition and/or creation of substantially identical layers or members 42, 44 each of which, in one non-limiting embodiment, comprise substantially identical and commercially available layers of dielectric adhesive material having a substantially identical size, shape, and thickness.

[0024] Process 10, as shown best in FIG. 1(c), further requires the acquisition and/or creation of an electrically conductive member or layer 46 which, in one non-limiting embodiment, is formed from conventional and commercially available electrically conductive material such as copper having a thickness, in one non-limiting embodiment, ranging from about five micrometers to about one hundred fifty micrometers. Further, at least one aperture or “hole” 48 is created within the member or layer 46 by drilling, punching, and/or etching. As shown later, this at least one aperture 48 will selectively form a “non-grounded” via or “through hole”.

[0025] As shown best in FIG. 1(e), process 10 further requires the acquisition and/or creation of a second member 50 which is substantially similar to member 12. More particularly, member 50 includes a core portion or member 52 which is substantially similar to core portion 14, and top or first and bottom or second members or layer portions 54, 56 which are substantially and respectively similar to member/layer portions 16, 18. Layers 54, 56 each have several selectively formed apertures 58 which are effective to cause member 50 to have exposed top surface portions 60, 62, 64, 66, 68 and exposed bottom surface portions 70, 72, 74, 76, 78. In one embodiment of the invention, portions 60, 70; 62, 72; 64, 74; 66, 76; and 68, 78 are aligned (e.g., portions 74, 72, 70, 76, and 78 are respectively and wholly resident under portions 64, 62, 60, 66, and 68 and portions 74, 72, 70, 76, and 78 are respectively identical in size and shape to portions 64, 62, 60, 66, and 68). In a further embodiment of the invention, portions 60, 62, 64, 66, 68, 70, 72, 74, 76, 78 are each substantially similar in shape and size.

[0026] A pre-circuit assembly 92 is formed in the fifth step of the process 10, which is shown best in FIG. 1(f). Particularly, layer 18 of member 12 is attached by a conventional process or method to the top surface 80 of member or layer 42, effective to allow portions of layer 42 to overlay the previously formed apertures 20 within the layer 18, and more particularly, to overlay the exposed portions 32, 34, 36, 38, 40. The bottom surface 82 of member or layer 42 is attached, by a conventional process or method, to the top surface 84 of layer or member 46, thereby overlaying the previously formed aperture 48 and causing a portion of the member 42 to fill the aperture 48. The bottom surface 86 of the member 46 is attached, by a conventional process or method, to the top surface 88 of the layer or member 44 and the attached surface 88 overlays the previously formed aperture 48. Further, the bottom surface 90 of the layer 44 is attached, in a conventional manner, to the top layer 54 of member 50, effective to overlay apertures 58 within layer 54 and to, more particularly, overlay exposed portions 60, 62, 64, 66, and 68. This formed pre-circuit assembly 92 is best shown in FIG. 1(f).

[0027] As best shown in FIG. 1(g), process 10 continues with the creation of a pre-circuit assembly 94 which is created by selectively forming first and second apertures 96, 98 within the formed pre-circuit assembly 92. These apertures 96, 98 may be formed by drilling, etching, punching, or by any other conventional process or methodology. Particularly, the first aperture 96 is aligned with (e.g., extends through) the previously created aperture 48 and effectively extends the previously created aperture 48 through the formed pre-circuit assembly 94. The second aperture 98, in one non-limiting embodiment, is substantially identical in shape and size to the aperture 96 and is aligned with (e.g., extends through) apertures 30, 40. It should be realized that apertures 96, 98 may be of various sizes and shapes and that nothing in this description should or is meant to limit these apertures 96, 98 to any certain size or shape.

[0028] Exposed surfaces 100, 102 of pre-circuit assembly 94 are respectively contained within and/or reside within and/or define the apertures 96, 98 and form respective “interior surfaces” of apertures 96, 98. In one non-limiting embodiment of the invention, member 46 functions as or comprises an electrical ground plane (i.e., member 46 is physically and electrically coupled to a source of electrical ground potential). As shown, member 46 does not reside within aperture 96 and does not reside upon surface 100. Hence, interior surface 100 is electrically isolated and/or electrically disconnected from member 46, thereby causing aperture 96 to be a “non-grounded via” or a “non-grounded aperture”. Member 46 does reside within aperture 98 and does reside upon surface 102. Hence, interior surface 102 is electrically connected to member 46, thereby causing aperture 98 to be a “grounded via” or a “grounded aperture”.

[0029] In the eighth step of process 10, which is shown best in FIG. 1(h), a certain substance or material 104 is applied upon exposed portions 106 of layers 14, 42, 44, 52 which reside within apertures 96, 98 and which reside upon and/or which form an integral part of surfaces 100, 102, thereby forming pre-circuit assembly 108, having a top surface 110 and a bottom surface 112.

[0030] In one non-limiting embodiment of the invention, the dielectric adhesive material layers or members 42, 44, 52, and 14 which are contained within portion 106 are “metallized” by using known “direct metallization” methods or by use of conventional electroless methods and/or by use of an electrically conductive layer 104 which is formed upon the adhesive surface 106. The applied material 104 may, in one non-limiting embodiment, comprise palladium alloy, carbon, graphite, or copper or any other suitable and/or similar material. It should be appreciated that material 104 is applied to these dielectric adhesive members or layers 14, 42, 44, 52 to “metallize” the exposed portions 106. Material 104 is similarly bonded to these respective portions of conductive members 16, 18, 46, 54, and 56 which reside within the apertures 96, 98, thereby allowing for the creation of a continuous electrically conductive layer over aperture boundary or defining surfaces 100, 102.

[0031] In the ninth step of process 10, which is best shown in FIGS. 1(i), a conventional and commercially available “resist” material 114 is applied and/or “screen printed” in a conventional and known manner upon most of the exposed portions of layer 16 and layer 14 and upon most of the layers 52 and 56, effective to cause certain portions 116 of layer 16 and certain portions 118 of layer 56 to remain exposed, and to form a pre-circuit assembly 120. Particularly, in one non-limiting embodiment, these certain portions of layers 116, 118 are proximate to the respective and previously formed apertures 96, 98.

[0032] In the tenth step of process 10, which is best shown in FIG. 1(j), a conventional and commercially available copper material 122 is applied (e.g., electroplated) upon the certain exposed portions 116, 118 and also, in one non-limiting embodiment, upon the material 104 covering the first and second surfaces 100, 102, thereby forming a pre-circuit assembly 124.

[0033] In the eleventh step of process 10, which is shown best in FIG. 1(k), material 114 is removed by a conventional process or methodology, thereby forming a pre-circuit assembly 126. In the twelfth step of process 10, as best shown in FIG. 1(l) and FIG. 2, the members 14, 52 are selectively etched in order to selectively form air-bridges or crossover members 128, thereby creating a multi-layer circuit assembly 130. The formed air-bridge or crossover members 128, in one non-limiting embodiment, cooperatively form a void 132.

[0034] In the twelfth step of process 10, which is shown best in FIGS. 1(m), a conventional and commercially available polymer material 134 is applied to pre-circuit assembly 130 to substantially “fill” the void 132, thereby “underfilling” and structurally supporting the formed air bridges or crossover members 128 and creating a pre-circuit assembly 136.

[0035] It should be appreciated that the selective etching of core members 14, 52 allows the air bridges and/or crossover members 128 to be efficiently and relatively easily formed in a cost effective manner. Further, such etching allows for the selective formation of air bridges and/or crossover members 128 which may have a selected shape and/or size, thereby allowing the selectively and etchably created air bridges and/or crossover members 128 to support a wide variety of circuits and components, effective to selectively and efficiently accommodate a wide variety of circuit interconnection methodologies and/or techniques. Further, the structural support given to the formed air bridges or crossover members 128 allows the air-bridges or crossover members 128 to support relatively heaving wiring and/or components, thereby increasing the overall utility of the formed circuit assembly 136.

[0036] It should further be appreciated that the apertures 96, 98 may also be efficiently formed and/or created in a “single step” operation which obviates the need to separately drill or create apertures in each member/component which selectively forms the created multi-layer circuit assembly 136, thereby increasing the overall efficiency of process 10.

[0037] Referring now to FIGS. 3(a)-(f), there is shown a process 140 for making an electronic circuit board assembly in accordance with the teachings of an alternate embodiment of the invention. Particularly, process 140 begins by obtaining and/or providing a pre-circuit assembly 142 having a core portion or member 144. As shown, several electrically conductive portions or members 146 are contained and/or disposed upon the top or first surface 147 of member 144, and several electrically conductive portions or members 148 are contained and/or disposed upon the bottom or second surface 149 of member 144, as shown best in FIG. 3(a). In one non-limiting embodiment of the invention, core portion 144 comprises conventional and commercially available aluminum material while layers/members 146, 148 comprise conventional, commercially available, and substantially identical electrically conductive material, such as copper. Hence, member 142 comprises, in one non-limiting embodiment, a “copper clad aluminum member”.

[0038] In the second step of process 140, as shown best in FIG. 3(b), a layer of adhesive material 150 is acquired and/or created having a top or first surface 152 and a bottom or second surface 154. Virtually any type of adhesive material may be selectively utilized within this process 140.

[0039] In the third step of process 140, as shown best in FIG. 3(c), a pre-circuit assembly 156 is provided. Particularly, in one non-limiting embodiment, pre-circuit assembly 156 is comprised of or includes a core portion 158 which contains apertures 160, 162, 164. Particularly, core portion 158 contains a first electrically conductive layer or member 166 which is disposed on top or first surface 167 and a second electrically conductive layer or member 168 which is disposed on bottom or second surface 169. As shown, members 166, 168 each include apertures which are aligned with a unique one of the respective apertures 160, 162, and 164. In one non-limiting embodiment of the invention, core portion 158 comprises conventional and commercially available laminate material while layers/members 166, 168 comprise conventional, commercially available, and substantially identical electrically conductive material, such as copper.

[0040] In another non-limiting embodiment of the invention, core portion 158 may be formed from a wide variety of conventional and commercially available individual circuit boards 159(a)-159(d) such as a conventional “FR-4” or a conventional “rigid circuit board”. As shown, boards/portions 159(a) and 159(b) are separated by a separation distance, region, or aperture 164; portions 159(c) and 159(b) are separated by a separation distance, region, or aperture 162; and portions 159(b) and 159(a) are separated by a separation distance, region, or aperture 160. It should be appreciated that selective numbers of “pre-formed” and commercially available boards 159(a-d) may be utilized within assembly 140.

[0041] In the fourth step of process 140, as shown best in FIG. 3(d), portions 148 of pre-circuit assembly 142 are attached to the top surface 152 of material 150. Material 166 of pre-circuit assembly 156 is attached to the bottom surface 154 of material 150, thereby forming pre-circuit assembly 170. It should be realized that circuit assembly 156 may be formed/created concurrently with assembly 140, or separately. Moreover, the use of commercially available circuit assemblies 159(a)-159(d) reduces the overall cost of process 140 and allows for the use of the created circuit assemblies in a wide variety of applications. Moreover, separate fabrication and/or creation of assemblies 142 and 156 allows for the separate creation of power traces and allows for a more efficient creation of the final circuit board assembly.

[0042] In the fifth step of process 140, as best shown in FIG. 3(e), process 140 continues by applying a certain etchant material (e.g., an aluminum etchant material) to certain selective portions of core portion 144, effective to remove or “etch away” certain selective portions of core portion 144, thereby forming pillar portions 172(a)-(e) of core portion 144 which reside upon the top surface 152 of material 150 and which may selectively overlay apertures 160, 162, 164, thereby forming pre-circuit assembly 174.

[0043] In the sixth step of process 140, as shown best in FIG. 3(f), process 140 continues by drilling or otherwise causing apertures 160, 162, 164 to extend through pre-circuit assembly 174 and through pillars 172(a), 172(c), 172(e), thereby forming pre-circuit assembly 176. It should be appreciated that apertures 160, 162, 164 may be electroplated or processed in a manner which allows for apertures 160, 162, 164 to form circuit interconnections.

[0044] Referring now to FIGS. 4(a)-(e), there is shown a process 180 for making an electronic circuit board assembly in accordance with the teachings of an alternate embodiment of the invention. Particularly, process 180 begins by obtaining and/or providing a pre-circuit assembly or a member 182 having a core portion 184 which includes electrically conductive portions or members 186 which are disposed upon top or first surface 187, and several electrically conductive portions or members 188 which are disposed upon bottom or second surface 189. In one non-limiting embodiment of the invention, core portion 184 comprises conventional and commercially available aluminum material while layers/members 186, 188 comprise conventional, commercially available, and substantially identical electrically conductive material, such as copper.

[0045] In the second step of process 180, as shown best in FIG. 4(b) and FIG. 4(d), a pair of dielectric adhesive layers or members 190 and 192 are acquired and/or created. These members 190, 192 respectively have top surfaces 194, 196 and bottom surfaces 198, 200.

[0046] In the third step of process 180, as shown best in FIG. 4(c), a pre-circuit assembly 202 is provided which is generally and relatively flexible. Particularly, assembly 202 comprises a substantially and relatively flexible core member or portion 204 having several electrically conductive portions or members 206 which are disposed upon the top or first surface 207 and having several electrically conductive portions or members 208 which are selectively disposed upon the second or bottom surface 209.

[0047] In the fourth step of process 180, as shown best in FIG. 4(e), pre-circuit assembly 210 is provided. Particularly, pre-circuit assembly 210 includes a core member or portion 212 having several electrically conductive portions or members 214 disposed upon a first or top surface 215 and having several electrically conductive portions or members 216 selectively disposed upon a second or bottom surface 217. In one non-limiting embodiment of the invention, core portion 212 comprises conventional and commercially available aluminum material while layers/members 214, 216 each comprise conventional, commercially available, and substantially identical electrically conductive material, such as copper.

[0048] In the fifth step of process 180, as shown best in FIG. 4(f), members 188 of pre-circuit assembly 182 are operatively attached or coupled to the top surface 194 of adhesive 190. Portions 206 of pre-circuit assembly 202 are then operatively connected and/or coupled to the bottom surface 198 of material 190. Portions 208 of pre-circuit assembly 202 are coupled to the top surface 196 of material layer 192. Portions 214 of pre-circuit assembly 210 is operatively connected and/or coupled to the bottom surface 200 of material layer 192, forming a pre-circuit assembly 270 which may be processed by drilling, electroplating, and/or any other process or methodology producing circuit layer interconnections. It should be appreciated that pre-circuit 270 may be subjected to a certain etchant material (e.g., and aluminum etchant material) which “etches away” or removes certain portions of core metal members 184, 212 and which allows the formed pre-circuit assembly to be substantially and relatively flexible.

[0049] It should be appreciated that the pre-circuit assemblies formed by processes 140, 180 may be constructed and/or otherwise assembled by the use of multi-layer circuit boards which are formed prior to the use of processes 140, 180 or by attaching multi-layer circuit boards formed concomitantly with process 140, 180. It should further be appreciated that “adhesive” or “non-adhesive” containing circuit boards and/or circuit board assemblies may be alternately and selectively used concomitantly with processes 140, 180. In one non-limiting embodiment of the invention, these circuit boards may be alternately and selectively used to produce circuit interconnections of the “power” type, the “signal” type, the “ground plane” type, or the “interconnection” type.

[0050] It should be understood that the invention is not limited to the exact embodiment or construction which has been illustrated and described but that various changes may be made without departing from the spirit and the scope of the invention. 

What is claimed is:
 1. A circuit board comprising: a first electrically conductive member having a first and a second surface; a first dielectric member which is coupled to said first surface; a second dielectric member which is coupled to said second surface; a first circuit assembly having a second electrically conductive member which is coupled to said first dielectric member, said first circuit assembly further including a third electrically conductive member and a first core member which is contained between said second and said third electrically conductive members and which includes at least one air-bridge; and a second circuit assembly having a fourth electrically conductive member which is coupled to said second dielectric member, said second circuit assembly further including a fifth electrically conductive member and a second core member which is contained between said fourth and said fifth electrically conductive members and which includes at least one air-bridge, said second circuit assembly cooperating with said first circuit assembly and with said first and second dielectric material and with said first electrically conductive member to form a multi-layer circuit board.
 2. The circuit board of claim 1 further comprising material which supports said at least one air-bridge of said first circuit assembly.
 3. The circuit board of claim 1 wherein said first and second core members comprise aluminum and wherein said first electrically conductive member comprises copper.
 4. The circuit board of claim 1 further comprising a first aperture having a first surface which extends through said first, second, third, fourth, and fifth electrically conductive members, said first and second dielectric members, and said first and second core members.
 5. The electronic circuit board of claim 4 further comprising a second aperture which has a second surface which is electrically isolated from said first electrically conductive member.
 6. The circuit board of claim 5 wherein said first electrically conductive member is coupled to an electrical ground potential.
 7. The circuit board of claim 5 wherein said first and second apertures contain electroplated material upon said respective first and second surfaces.
 8. A method for making an electrical circuit assembly comprising the steps of: providing a first member having a first core portion which is contained between a top and a bottom layer; providing a second member having a second core portion which is contained between a top and a bottom layer; providing first layer and a second layer of a first material; providing a third member; removing a portion of said top and said bottom layer of said first member, thereby exposing at least two portions of said core portion of said first member; removing a portion of said top and said bottom layer of said second member, thereby exposing at least two portions of said core portion of said second member; creating a first pre-circuit assembly by attaching the first layer of said first material to a first surface of said third member, attaching the second layer of said first material to a second surface of said third member, attaching said first member to said first layer of said first material, and attaching said second member to said second layer of said first material; creating an aperture through said first pre-circuit assembly, thereby causing a portion of said first pre-circuit assembly to be contained within said created aperture; applying an electrically conductive material to said portion of said first pre-circuit assembly which is contained within said aperture; and selectively removing portions of said first and second core portions, thereby creating a circuit assembly having at least one air-bridge and forming an electrical circuit assembly.
 9. The method of claim 8 wherein said third member comprises an electrical ground plane and wherein said method further comprises the step of isolating said portion of said first pre-circuit assembly which is contained within said aperture from said third member.
 10. The method of claim 8 wherein said first material comprises a dielectric adhesive material.
 11. The method of claim 8 wherein said core portion of said first member comprises aluminum and wherein said top and bottom layers each comprise copper.
 12. The method of claim 8 further comprising the step of creating a first aperture within a certain portion of said third member; and extending said first aperture through said first pre-circuit assembly.
 13. The method of claim 8 further comprising the step of applying said electrically conductive material to certain portions of said top layer of said first member and said bottom layer of said second member.
 14. The method of claim 8 wherein said step of selectively removing portions of said core portion comprises the step of selectively etching said core.
 15. The method of claim 9 further comprising the steps of creating a second aperture through said first pre-circuit assembly, thereby exposing a second surface of said first pre-circuit assembly within said second aperture, said second surface including a portion of said third member.
 16. The method of claim 9 wherein said step of applying an electrically conductive material to said portion of said first pre-circuit assembly comprises the step of electroplating copper material upon said portion of said first pre-circuit assembly.
 17. A method for making a circuit board comprising the steps of: forming a first pre-circuit assembly having a first core member having a first and a second surface, said first pre-circuit assembly further including a first plurality of electrically conductive members disposed upon said first surface and a second plurality of electrically conductive members disposed upon said second surface; forming a second pre-circuit assembly having first and second circuit boards which are selectively attached to a dielectric adhesive material and which cooperatively form a separation region; coupling said dielectric adhesive material to said second plurality of electrically conductive portions; removing certain portions of said first core member, thereby forming at least one pedestal portion which abuts one of said separation regions; and extending said separation region through said at least one pedestal portion, thereby forming a circuit board.
 18. The method of claim 17 wherein said core member comprises aluminum.
 19. The method of claim 18 wherein said first and second plurality of electrically conductive members each comprise copper.
 20. The method of claim 19 wherein said step of removing said certain portions of said first core member comprises selectively etching said first core member. 